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Sensesecmi Technologies, a fabless semiconductor startup, has raised Rs 25 crore (about $2.75 million) in a seed funding round led by Piper Serica.
The round also saw participation from LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, Whitepine Investments, Jain Oncor, along with other angel investors.
The new funds will be used in 2026 to design and test the first two prototype chips and build a core engineering team to develop a production-ready version. It will also focus on field testing, letting potential customers run real-world applications on the chip.
By 2027, the startup plans to work on the production version of the first-generation chip.
Read also- Voice AI Startup Bolna Raises INR 57 Cr in Seed Round
“As the name suggests, we work on sensing semiconductors. There are a lot of sensors in the world today, but there is no intelligence at the sensor node itself. That is where we come in, bringing intelligence directly to the sensor node,” Vijay Muktamath, founder and CEO of Sensesemi.
Muktamath said the company is focused on combining AI and wireless features while keeping power use extremely low. In areas like healthcare, automotive, robotics, and industrial IoT, battery-operated devices make low power consumption especially important.
Founded in 2014, Sensemi develops mixed-signal, power-efficient chips for sensing and edge applications. The startup focuses on combining sensors, signal processing, and intelligence on a single chip to deliver high-performance solutions for a range of uses.
At the same time, Sensemi is building an analog AI inference processor designed to greatly reduce power consumption in battery-operated and implantable devices. Co-founder and head of engineering Namit Varma explained that applications like medical implants and industrial sensors have strict limits on power, size, and cost.
Using analog-domain AI inferencing allows the chips to achieve high energy efficiency, enabling multi-year battery life without sacrificing performance or reliability.
The startup is targeting a fast-growing market with the global edge-AI chipset market expected to reach 5–7 billion units annually by 2030, driven by industrial adoption and medical applications like point-of-care and implantable systems.
Sensemi’s integrated edge-AI chips are aimed at high-growth sectors such as industrial IoT, automotive and medical devices, supporting use cases from predictive maintenance and ADAS to cardiac monitoring and smart drug delivery.
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